About Eridu AI 

Eridu AI is a Silicon Valley hardware startup focused on accelerating training and inference performance for large AI models. Today’s AI model performance is often gated by infrastructure bottlenecks. Eridu AI introduces multiple industry-first innovations across semiconductors, software and systems to deliver solutions that improves AI data center performance to increase GPU utilization while simultaneously reducing capex and power. Eridu AI’s solution and value proposition have been widely validated with several hyperscalers.  

The company is led by a veteran team of Silicon Valley executives and engineers with decades of experience in state-of-the-art semiconductors, optics, software, and systems, including serial entrepreneur Drew Perkins, co-founder of Infinera (NASDAQ: INFN), Lightera (acq. by Ciena), Gainspeed (acq. by Nokia) and Mojo Vision (World’s leading micro-LED display company and developer of the first augmented reality contact lens).

Position Overview

We are seeking a skilled and innovative leader to join our growing team as Director, Packaging Engineering – CoWoS. This role will own the development and optimization of Chip-on-Wafer-on-Substrate (CoWoS) packaging technology to support high-performance AI and data center applications. You will lead and collaborate with design, process, manufacturing, and materials teams to enable seamless integration of advanced multi-die packages. If you are passionate about cutting-edge semiconductor packaging, we’d love to hear from you.

Responsibilities 

• Lead CoWoS packaging development.
• Develop and optimize CoWoS packaging processes to improve chip performance, power, and reliability.
• Collaborate with design, test, and manufacturing teams for seamless chip-package integration.
• Drive failure analysis and yield improvements across packaging flows.
• Ensure CoWoS packaging meets thermal, mechanical, and electrical performance requirements.
• Support new product introduction (NPI), from prototyping through high-volume manufacturing.
• Work closely with foundry and OSAT partners (e.g., TSMC, ASE, Amkor, SPIL, etc.) on process qualification and production ramp-up.

Qualifications

• Bachelor’s or Master's degree in Electrical Engineering, Materials Science, Mechanical Engineering, or related field.
• Minimum 15 years’ hands-on experience in advanced semiconductor packaging and interconnect processes.
• Demonstrated expertise in CoWoS / FOCoS (highly preferred), or FOWLP; and proficiency in EMIB, InFO, and advanced 2.5D/3D integration technologies is a plus.
• Strong understanding of thermal management, reliability testing, and signal/power integrity challenges.
• Excellent analytical and problem-solving skills with a proactive, collaborative approach.
• Experience working with TSMC and leading OSATs.
• Fluent in Mandarin and English preferred.

Why Join Us?

At Eridu AI, you’ll have the opportunity to shape the future of AI infrastructure, working with a world-class team on groundbreaking technology that pushes the boundaries of AI performance. Your contributions will directly impact the next generation of AI networking solutions, transforming data center capabilities.

The starting base salary for the selected candidate will be established based on their relevant skills, experience, qualifications, work location, market trends, and the compensation of employees in comparable roles.