Avicena is a privately held company developing microLED based ultra-low power high bandwidth interconnects for chip-to-chip communications.  This technology will revolutionize High-Performance (HPC) and Cloud computing, as well as other industries where low power interconnects are critical like camera sensors, autonomous vehicles, and aerospace. Avicena is headquartered in Sunnyvale, California with a development center in Edinburgh, Scotland. The company was founded in 2019 by leading technologists from the optical networking industry with a track record of delivering breakthrough products.  (www.avicena.tech)   

About the role:

• Lead the architecture, design, and development of advanced semiconductor packaging solutions, including 2.5D/3D IC, System-in-Package (SiP), Flip Chip, and Wafer-Level Packaging
• Lead development, characterization, and optimization of TSV (Through-Silicon Via) reveal processes, including back grind, CMP, dielectric/barrier reveal etch, and thickness/uniformity control across wafer thinning stacks
• Own C4 bumping process flows — UBM deposition, solder bump plating or ball drop, reflow, and flux clean — for flip-chip and 3D-IC applications
• Develop and maintain process control plans (SPC), DOEs, and yield improvement roadmaps for optical engine packaging and bumping modules
• Partner with integration engineering to co-optimize TSV reveal with downstream hybrid bonding, micro-bump, or RDL processes
• Troubleshoot excursions using FA data, cross-sections, and metrology (CD-SEM, profilometry, XRF, AOI) to root-cause defects such as TSV protrusion variation, via reveal non-uniformity, bump voiding, or co-planarity issues
• Support new product/technology introduction (NPI) from pathfinding through HVM transfer
• Collaborate cross-functionally with design, reliability, and test teams to ensure package-level electrical and mechanical performance targets are met
• Mentor junior engineers and contribute to internal process documentation and best-practice standards

Qualifications:

• MS/PhD in Materials Science, Electrical Engineering, Chemical Engineering, Mechanical Engineering or related field
• 5+ years of hands-on experience in semiconductor packaging or wafer fab process engineering - working with major OSAT’s (ASE, AMKOR, SpiL etc). An extensive personal network within key OSATs would be very advantageous
• Direct, hands-on experience with TSV reveal (grinding, CMP, dielectric reveal, thickness metrology) and C4 bumping (UBM, electroplating or solder ball attach, reflow)
• Strong understanding of 2.5D/3D packaging architectures (interposers, chiplets, HBM integration, hybrid bonding is a plus)
• Deep understanding of semiconductor device physics, packaging materials, and thermal/mechanical analysis
• Experience with statistical process control, DOE methodology, and yield analysis
• Familiarity with metrology and inspection tools relevant to bumping/TSV (CD-SEM, AFM, profilometers, X-ray, AOI/SEM defect review)
• Working knowledge of cleanroom fab operations and contamination control
• Excellent cross-functional communication skills; comfortable working with equipment OEMs and multi-site teams

Preferred Qualifications:

• Experience with copper pillar bumping, micro-bump, or hybrid bonding processes
• Background in wafer thinning and temporary bonding/debonding for advanced node packaging
• Exposure to reliability testing (thermal cycling, electromigration, HAST) for packaged parts
• Experience supporting HVM ramp in an OSAT or IDM environment